date:Apr 19, 2023
price:0.00/piece
model:Planting Platform
standard:shenzhen
brand:D/A D/P L/C T/T PayPal
minamount:1piece
amount:100000piece
Delivery time:3days
contact
company:Shenzhen weixiu technology Co.,Ltd
send:click send
name:phonefix nicole(Mr.)
telephone:18929708712
mobile:18929708712
adress:JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District,
post code:518116
Email:phonefix2783@gmail.com
Details
MJ Z20 Pro Phone motherboard middle layer fram tin planting platform with stencil steel mesh for Phone X-14 Pro Max motherboard soldering repair.
Product Features:
Phone X-14 PRO MAX BGA reballing fixture tool.
Used for positioning and reballing Phone X-14 Pro Max PCB BGA parts.
Convenient and faster for reballing BGA without any damage.
Offer you best solution forPhone X-14 Pro Max BGA reballing and repairing.
How to install:
Install the Phone X-14 Pro Max main board on the platform
Co