MAX/12 MINI/13/13 mini/13 Pro/13 Pro Max.
2. Used for Phone motherboard layered and fitting, tin planting, BGA desoldering, IC glue removal, dot matrix
Face ID repair, rear camera repair.
3. Intelligent adjustable temperature, modular design
4. No air gun and no soldering iron, just plug and use
5. Multiple combination modules, good scalability, easy to expand new modules.
6. Host size: 12*14cm
7. Voltage 110V/220V