p minimize the distance between lamp and IC , to facilitates heating.
3. Ensure that the working environment is no greater airflow to prevent heat loss , well sheltered measures when necessary.
4. Apply solder paste to the IC before the desoldering , also you can early preheat then Apply solder paste , Especially BGA package IC , should be early preheat then apply solder paste , the can make solder paste penetrate into the bottom of the IC.
5. Wear heat protective gloves and goggles. Place th