of components, such as: SOIC, CHIP, QFP,PLCC, BGA, etc.
2. Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection,Glue welding, etc.
3. The air volume is adjustable, suitable for fields that require small air volume and large air volume heating together.
4. Suitable for lead-free hot air desoldering occasions.
Quick operation:
Temperature unit conversion
During use, press the multi-function button to use the warm
Degree ℃℉ or ℉℃.Buzzer settingsDuri