Dow Packaging gets technology innovation award for Robond L-95D adhesive
date:Jul 26, 2012
The award was presented to the company in Shanghai recently.

The product was developed through the joint efforts of the Dow Chemical Company's RD centre in Buffalo Grove, IL, USA, and the Dow Shanghai Technology Center in China. It utilises Dow's acrylic emulsion technology with a focus on the balance between product performance and operational convenience while creating sustainability benefits for packaging manufacturers.

Being recognised by Ringier, one of the most notable trade media organi
1/2 next page prev page home page last page
go back |  refresh |  WAP home |  Web page version  | login
05/15 16:50