date:Jul 18, 2014
h our customers to discuss how we can best work with them to optimise their production.
We hope everyone visiting the SICK stand will gain at least one new insight that they can take back to improve their own processes. We want them to feel we took time out for networking and discussion with them.
Headlining new technologies developed for packaging processing applications at the show include a range of products designed to detect the packaging that many sensors find difficult or impossible to