Bemis to fit printed electronics on its packaging by 2014
date:Jul 14, 2012
nce.

It will allow us to make observations for packaging when it contains consumer products throughout the chain.

Davor Sutija, CEO of Thinfilm said: These are exciting times for the printed electronics market, where innovative solutions that simply could not be manufactured before are soon to be delivered.

Our partnership with Bemis will lead to new categories and types of packaging that will bring intelligence to the everyday lives of millions of people worldwide.
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