Bemis to fit printed electronics on its packaging by 2014
date:Jul 14, 2012
labels]will focus on the product roadmap, as they observe humidity, temperature and environmental factors in their electronic memory, so we can monitor and follow the packaging through all its attributes.

It aligns with our long term structure, to invest in new and emerging technology and acquire technology to benefit our customers.

The result is recording information to correlate potency and safety that the product experiences due to conditions it is put through and analyse packaging performa
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