Bemis to fit printed electronics on its packaging by 2014
date:Jul 14, 2012
have been following events and the technological evolution over the last two years with regards to printed electronics and now is the right time to move in as it intersects with our technology, with[Thinfilms]expertisespecialised in their field where ours is in conventional packaging.

I believe eventually industry will take it up when the technology is there but cost needs to go down.

Nimis said he was not aware of any other flexible packagers in this field at the moment.

In the short term we
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